Chiplets are rewriting the rules of silicon design — and AI is a key reason why. As AI workloads explode across datacenters, Edge deployments, and embedded systems, the monolithic SoC can no longer keep pace with the necessary performance, power, and cost demands. Chiplet-based heterogeneous integration is emerging as the architecture of the AI era.
Embedded Computing Design’s Chiplet Virtual Conference brings together the engineers, architects, and decision-makers spanning datacenter AI acceleration, embedded edge deployments, and the interoperability standards that will define the next decade of silicon, particularly chiplet-based semiconductors. If your company builds or offers chiplet IP, advanced packaging, EDA tools, interconnects, or AI silicon — this is the audience that needs to hear from you.
Establish your brand at the center of the chiplet conversation.
Topics Include:
Session 1 – Co-Sponsorship Opportunity Chiplets for High-Performance AI, aka the Datacenter and Edge Applications
Session 2 – Co-Sponsorship Opportunity:How to Deploy Chiplets in Embedded System Design
Roundtable: The Open Chiplet Economy: Will Multi-Vendor Interoperability Actually Work?